凯发k8国际

Mini LED Wafer Laser Stealth Cutting Equipment
This equipment is mainly used for LED blue-green sapphire wafer cutting and processing, internal quality modification. The equipment includes automatic loading and unloading units, counterpoint unit, a laser Stealth Cutting unit and a control unit.
Main Advantages
  • 01
    Equipped with high precision linear motor, high speed X-Y movement platform
  • 02
    Unattended fully automatic processing for both normal wafer and debris
  • 03
    Independent research and development of DFT technology, high efficiency and high quality processing
  • 04
    Automatically bar codes scanning and production information uploading
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Equipment Picture
Basic Parameters
  • 1. High machining accuracy: Cut size edges ≤ 1.5μm
  • 2. High processing efficiency: Max Running Speed 1000mm/s
  • 3. Good Cutting: Cut wavy lines ≤ ± 2μm
  • 4. Machinable wafer size: 2 ~ 6 inches of wafer, capability of stealth cutting for minimum cutting path of 12μm
  • 5. Product compatibility: Machinable traditional LED Sapphire Wafer and Mini LED wafer
  • 6. Easy maintenance of the equipment: utilizing bus control system, self-diagnosis system, with low failure rate, high stability and high maintainability
  • 7. Design/Manufacturing/Maintenance integration to ensure the consistency, stability and rapid responding of the equipment
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